Showing 133–140 of 140 results
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AMAOE X90 PRO MIDDLE LAYER STENCIL FOR VIVO X90 PRO
Original price was: ₹379.00.₹279.00Current price is: ₹279.00.AMAOE X9P-012 STENCIL FOR VIVO X90 PRO MIDDLE LAYER BGA REBALLING, PRECISELY DESIGNED FOR MOTHERBOARD CHIP REPAIR AND REPLACEMENT.
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AMAOE XF-012 MIDDLE LAYER STENCIL FOR VIVO X-FLIP
Original price was: ₹379.00.₹279.00Current price is: ₹279.00.HIGH-PRECISION 0.12 MM THICK JAPANESE STEEL MIDDLE-LAYER BGA REBALLING STENCIL FOR THE VIVO X FLIP MOTHERBOARD, WITH SQUARE HOLE PATTERN, REUSABLE, SUPER HARD MATERIAL.
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AMAOE ZFLIP3 5G SM F711U MIDDLE LAYER STENCIL
Original price was: ₹379.00.₹279.00Current price is: ₹279.00.HIGH-QUALITY AMAOE STENCIL DESIGNED FOR SAMSUNG ZFLIP3 5G SM-F711 SERIES. IDEAL FOR MIDDLE LAYER MOTHERBOARD REBALLING AND IC REPAIR WITH PERFECT ALIGNMENT AND DURABILITY.
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AMAOE ZFLIP4 SM-F721U-012 MIDDLE LAYER STENCIL
Original price was: ₹379.00.₹279.00Current price is: ₹279.00.AMAOE ZFLIP4 SM-F721U-012 STENCIL IS A HIGH-QUALITY BGA REBALLING STENCIL DESIGNED FOR SAMSUNG ZFLIP4 MOTHERBOARD REPAIR.
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AMAOE ZFOLD3 SM-F926/W2022 MIDDLE LAYER STENCIL
Original price was: ₹379.00.₹279.00Current price is: ₹279.00.DESIGNED FOR PRECISE BGA REBALLING AND CHIP ALIGNMENT ON SAMSUNG ZFOLD3 SM-F926/W2022 MAINBOARD.
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AMAOE ZFOLD4 SM-F936U-012 MIDDLE LAYER STENCIL
Original price was: ₹379.00.₹279.00Current price is: ₹279.00.AMAOE ZFOLD4 SM-F936U-012 STENCIL IS A PREMIUM QUALITY BGA REBALLING STENCIL DESIGNED FOR PRECISE AND EFFICIENT MOTHERBOARD REPAIR OF SAMSUNG GALAXY ZFOLD4.
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AMAOE ZNYX-1 STENCIL
Original price was: ₹349.00.₹249.00Current price is: ₹249.00.A HIGH-PRECISION, JAPANESE STEEL STENCIL USED FOR REBALLING BGA (BALL GRID ARRAY) CHIPS IN MOBILE DEVICE AND ELECTRONICS REPAIR.
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MEGA IDEA BLACK UNIVERSAL STENCIL
Original price was: ₹349.00.₹249.00Current price is: ₹249.00.MEGA IDEA BLACK UNIVERSAL STENCIL IS A HIGH-QUALITY, MULTIPURPOSE STENCIL DESIGNED FOR PRECISE AND EFFICIENT IC REBALLING ON VARIOUS DEVICE MODELS.
