Description
A HIGH-PRECISION, JAPANESE STEEL STENCIL USED FOR REBALLING BGA (BALL GRID ARRAY) CHIPS IN MOBILE DEVICE AND ELECTRONICS REPAIR.
Original price was: ₹349.00.₹249.00Current price is: ₹249.00.
A HIGH-PRECISION, JAPANESE STEEL STENCIL USED FOR REBALLING BGA (BALL GRID ARRAY) CHIPS IN MOBILE DEVICE AND ELECTRONICS REPAIR.
A HIGH-PRECISION, JAPANESE STEEL STENCIL USED FOR REBALLING BGA (BALL GRID ARRAY) CHIPS IN MOBILE DEVICE AND ELECTRONICS REPAIR.
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