Description
HIGH-PRECISION MIDDLE LAYER BGA REBALLING STENCIL FOR HUAWEI P30 PRO, MADE OF DURABLE STEEL FOR ACCURATE AND REUSABLE MOTHERBOARD REPAIR WORK
Original price was: ₹379.00.₹279.00Current price is: ₹279.00.
HIGH-PRECISION MIDDLE LAYER BGA REBALLING STENCIL FOR HUAWEI P30 PRO, MADE OF DURABLE STEEL FOR ACCURATE AND REUSABLE MOTHERBOARD REPAIR WORK.
HIGH-PRECISION MIDDLE LAYER BGA REBALLING STENCIL FOR HUAWEI P30 PRO, MADE OF DURABLE STEEL FOR ACCURATE AND REUSABLE MOTHERBOARD REPAIR WORK
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