
AMAOE ZFOLD3 SM-F926/W2022 MIDDLE LAYER STENCIL
DESIGNED FOR PRECISE BGA REBALLING AND CHIP ALIGNMENT ON SAMSUNG ZFOLD3 SM-F926/W2022 MAINBOARD.
Made In: China
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₹ 279.00 ₹379
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AMAOE
DESIGNED FOR PRECISE BGA REBALLING AND CHIP ALIGNMENT ON SAMSUNG ZFOLD3 SM-F926/W2022 MAINBOARD.
