Samsung S20 SM-G986B 985G Middler Layer BGA Stencil Reball Solder Ball Tin Plant Net Amaoe Heat Steel Mesh S20-3-012 - SPARE FIX

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“AMAOE BGA Reballing Stencil for Pad SM6225 Qualcomm Snapdragon 680 CPU BGA153 BGA200 Direct heating BGA Template” has been added to your cart. View cart

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Samsung S20 SM-G986B 985G Middler Layer BGA Stencil Reball Solder Ball Tin Plant Net Amaoe Heat Steel Mesh S20-3-012

Samsung S20 SM-G986B 985G Middler Layer BGA Stencil Reball Solder Ball Tin Plant Net Amaoe Heat Steel Mesh S20-3-012

**Samsung S20 SM-G986B 985f Middler Layer BGA Stencil Reball Solder Ball Tin Plant Net Amaoe Heat Steel Mesh S20-3-012. Function: Reballing touch IC pins.**

Original price was: ₹349.00.Current price is: ₹249.00.

Samsung S20 SM-G986B 985G Middler Layer BGA Stencil Reball Solder Ball Tin Plant Net Amaoe Heat Steel Mesh S20-3-012 quantity

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