“AMAOE BGA Reballing Stencil for Pad SM6225 Qualcomm Snapdragon 680 CPU BGA153 BGA200 Direct heating BGA Template” has been added to your cart. View cart
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HI:1 STENCIL
AMAOE HI-1 STENCIL For HUAWEI HI POWER
SUPPORTED MODEL:-
- HI6555V1
- HI6421A V3
- HI6553 V1
- HI6551 V1
- HI6555V2
- HI6559V
- HI6921M V1
- HI6421GFC
- HI6421 V7
- HI6921 V1
- HI6421 V6
- HI6421 B V5
- HI6561 V1
- HI6422 V2
- HI6523 V1
- HI6522 V2
- HI6403 V1
- HI6422 V2
- HI6423 V1
₹349.00 Original price was: ₹349.00.₹249.00Current price is: ₹249.00.
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