Amaoe-Medium ear binder, for Huawei P30pro, p30 pro, cpu chip, tin, soldering net, thickness 0.12mm,p3 012 stencil - SPARE FIX

“AMAOE BGA Reballing Stencil for Pad SM6225 Qualcomm Snapdragon 680 CPU BGA153 BGA200 Direct heating BGA Template” has been added to your cart. View cart

SPARE FIX

Amaoe-Medium ear binder, for Huawei P30pro, p30 pro, cpu chip, tin, soldering net, thickness 0.12mm,p3 012 stencil

Amaoe-Medium ear binder, for Huawei P30pro, p30 pro, cpu chip, tin, soldering net, thickness 0.12mm,p3 012 stencil

Amaoe Middle Layer BGA Reballing Stencil for Huawei P30Pro P30 Pro CPU IC Chip Tin Planting Soldering Net 0.12MM thickness. 2 Sold. Color : P3–012. P3–012.

Original price was: ₹380.00.Current price is: ₹350.00.

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