“Amaoe BGA Reballing Stencil Templat For Samsung Galaxy Z Flip SM-F700F F700U Middler Layer Solder Board Tin Plant Net Steel Mesh” has been added to your cart. View cart
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AMAOE HW12 STENCILE
AMAOE HW12 SPECIALY FOR HUAWEI PHONES
SUPPORTED CPU HI9500-V100 HI3690-V100
SUPPORTED EMMC&RAM HI3690-V100 RAM BGA200 BGA153
SUPPORTED IC’S 540 HI6D05 HI6421-V8 HI1103-V1 HI6365-V1 HI6526-V1 6H11
6H12 HI6422-V3 HI6405-V1 429
₹349.00 Original price was: ₹349.00.₹249.00Current price is: ₹249.00.
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