Description
HIGH-QUALITY 0.12 MM JAPANESE STEEL BGA REBALLING STENCIL FOR OPPO/VIVO CPU & BOARD REPAIR. IDEAL FOR ACCURATE SOLDER PASTE/BALL DEPOSITION IN PROFESSIONAL MOBILE MOTHERBOARD WORK.
Original price was: ₹349.00.₹249.00Current price is: ₹249.00.
HIGH-QUALITY 0.12 MM JAPANESE STEEL BGA REBALLING STENCIL FOR OPPO/VIVO CPU & BOARD REPAIR. IDEAL FOR ACCURATE SOLDER PASTE/BALL DEPOSITION IN PROFESSIONAL MOBILE MOTHERBOARD WORK.
HIGH-QUALITY 0.12 MM JAPANESE STEEL BGA REBALLING STENCIL FOR OPPO/VIVO CPU & BOARD REPAIR. IDEAL FOR ACCURATE SOLDER PASTE/BALL DEPOSITION IN PROFESSIONAL MOBILE MOTHERBOARD WORK.
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